IPIU 1998 (제10회 영상처리 및 이해에 관한 워크샵)
Current Result Document :
| 한글제목(Korean Title) |
영상처리를 이용한 Lead Frame에서 Lead 위치 측정 방법에 관한 연구 |
| 영문제목(English Title) |
A Study on searching lead position in the lead frame using image processing |
| 저자(Author) |
구창근
오영석
김기태
Chang-Keun Koo
Young-Suk Oh
Ki-Tae Kim
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| 원문수록처(Citation) |
VOL 10 NO. 01 PP. 0254 ~ 0259 (1998. 01) |
한글내용
(Korean Abstract) |
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영문내용
(English Abstract) |
Visions are the vital sense of everyday life and effective information exchange methods that process much information in short times. In this paper, We studied on the method of position searching in wire bonding machine. Wire bonding machines connect the first position on the Die made of the silicon wafer with the second position on the lead frame. We must search the second position on the lead frame. We proposed the method of the recognition each lead and made an experiment on the real image. This method is a robust about illumination, image noise and lead shifting in lead frame. The method is using the lead angle and width to confirm the object exists at the initial position.
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| 파일첨부 |
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